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System onlineADVACAM — 4-Chip Assembly, Large Area Imaging
AdvaPIX Quad Timepix3 Detector
M-01
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Key specifications
M-02
4
Applications
M-03
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Performance features
Overview
Technical record / 0026
The AdvaPIX series scales up the MiniPIX technology into multi-chip assemblies. The AdvaPIX Quad uses four Timepix3 readout chips tiled in a 2×2 array, providing a combined active area of approximately 2.8 × 2.8 cm with near-seamless imaging.
Each pixel independently measures particle energy (Time-over-Threshold) and arrival time (Time-of-Arrival) with 10 ns precision. The AdvaPIX is available with silicon, CdTe, or GaAs sensors to cover different energy ranges from a few keV to hundreds of keV.
Key Features
What Sets This Product Apart
014-chip tiled array for large-area imaging
02Per-pixel energy and time measurement
03Three sensor material options
04Continuous readout with zero dead time
Specifications
Technical Details
- 01Architecture: 4× Timepix3 chips, 2×2 array
- 02Total pixels: ~262k (4 × 256 × 256)
- 03Pixel pitch: 55 µm
- 04Sensor materials: Si, CdTe, GaAs
- 05Readout: Continuous dead-time-free
- 06Variants: MAGIC, MAGIC Dual, MAGIC Quad
Applications
Where It Excels
- 01Energy-resolved X-ray radiography
- 02Electron microscopy (4D-STEM)
- 03X-ray diffraction and crystallography
- 04Gamma-ray imaging
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