Technology Platforms

Choose the Right Optical Path

Four complementary platforms address detection, reflection, orientation, and focusing across EUV, X-ray, and particle-imaging workflows.

Selection guidance

Start from the measurement objective. We will help connect wavelength, sample, geometry, and performance requirements to a practical system.

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6 of 15 products

Photon detection

Single Photon Counting Pixel Detectors

The cameras are for material analysis, non-destructive testing, color radiography, or radiation safety. It senses every single particle of radiation of almost any kind, including X-rays, gamma, electrons, ions, and even neutrons. Based on CERN technology, our cameras revolutionize a range of industries, from space to medicine.

Pixel Size: 55µm × 55µm (Medipix2/3), 75µm × 75µm (Medipix4)
Pixel Matrix: 256 × 256 (Medipix2/3), 512 × 448 (Medipix4)

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EUV optics

13.5nm EUV Multilayer Mirror

This precision optical component is designed for EUV applications, specifically optimized for 13.5nm wavelength. Featuring a multilayer coating of alternating high- and low-refractive index materials, it enhances EUV light reflection. Ideal for EUV lithography and advanced scientific instruments, this mirror exemplifies cutting-edge EUV optics.

Peak Wavelength: 13.50 nm / 13.52 nm
Peak Reflectivity: >69% at near-normal incidence

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X-ray optics

Highest Efficiency Fresnel Zone Plates

High efficiency due to material choice (Au, Ni, Si, SiO₂, Ir, Cr, Diamond). Optimized phase shift and low absorption. Blazed optics overcome limitations of binary optics, delivering the highest possible diffraction efficiency for X-ray microscopy and synchrotron applications.

Outermost Zone Width: Down to 7 nm (line-doubled Ir), 15–50 nm (standard)
Zone Plate Diameter: 0.05 – 10 mm (custom larger available)

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Infrared imaging

Cooled VGA SWIR InGaAs Camera

A high-sensitivity short-wave infrared (SWIR) camera using a selected InGaAs sensor with VGA resolution (640 × 512). TE cooling reduces dark current for long-exposure imaging. Designed for scientific and industrial applications including semiconductor inspection, solar cell evaluation, and spectroscopy.

Sensor: InGaAs FPA, 640 × 512 (VGA)
Spectral range: 0.9 µm to 1.7 µm

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Photon detection

MiniPIX Timepix3 Pixel Detector

The MiniPIX is a compact, USB-powered pixel detector based on the CERN Timepix3 chip. It counts individual X-ray, gamma, electron, and ion particles with per-pixel energy resolution and 10 ns time resolution. Available in multiple configurations including the SPRINTER (fast readout), SPACE (radiation-hard), and EDU (educational).

Sensor: Timepix3 ASIC (256 × 256 pixels, 55 µm pitch)
Sensor materials: Si, CdTe, GaAs

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EUV optics

Custom EUV Multilayer Mirrors (13.5 nm)

OptiXfab fabricates precision multilayer mirrors for the EUV (13.5 nm), soft X-ray (1–13.5 nm), and XUV (13.5–100 nm) spectral regions. Standard mirrors achieve R > 65% at 13.5 nm with λ/20 form error. Custom optics are available up to 650 mm diameter with λ/50 precision, in spherical, cylindrical, toroidal, elliptical, and parabolic figures.

Peak wavelength: 13.5 nm (EUV), 1–13.5 nm (soft X-ray), 13.5–100 nm (XUV)
Reflectivity: R > 65% @ 13.5 nm (standard)

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